Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Solid Material Science
100
Liquid Material Science
100
Temperature Material Science
100
Composite Material Material Science
100
Solder Joint Material Science
80
Soldering Alloys Material Science
40
Shear Strength Material Science
20
Brittle Fracture Material Science
20
Thermal Expansion Material Science
20
Wetting Material Science
20
Ductile Fracture Material Science
20
Wettability Material Science

Keyphrases

100
Shear Strength Keyphrases
100
Bonding Technology Keyphrases
100
Solder Bonding Keyphrases
100
Liquid-solid Keyphrases
100
Composite Solder Jo... Keyphrases
100
Low-Temperature Sol... Keyphrases
100
Sn-based Composites Keyphrases
100
Mixed Solder Joints Keyphrases
50
Aging Keyphrases
50
Phase Transition Keyphrases
50
Solder Joint Keyphrases
50
Shear Fracture Keyphrases
50
Soldering Keyphrases
50
Brittle Fracture Keyphrases
50
Coefficient of Ther... Keyphrases
50
Diffusion Process Keyphrases
50
Reflow Keyphrases
50
Solder Paste Keyphrases
50
Mathematical Calcul... Keyphrases
50
Aging Time Keyphrases
50
Ductile Fracture Keyphrases
50
Ag3Sn Keyphrases
50
Solder Ball Keyphrases
50
Wetting Properties Keyphrases
50
SAC305 Solder Keyphrases
50
SAC305 Keyphrases
50
Big Data Era Keyphrases
50
Sn-58Bi Solder Keyphrases
50
COMSOL Multiphysics Keyphrases
50
Brittle Phase Keyphrases
50
Perfect Mixing Keyphrases
50
3D Packaging Keyphrases
50
Mixing Degree Keyphrases
50
Low-temperature Sol... Keyphrases
50
Sn58Bi Keyphrases
50
Composite Modes Keyphrases
50
PCB Component Keyphrases
50
BGA Components Keyphrases
50
Dynamic Warpage Keyphrases
50
Solder Wettability Keyphrases

INIS

100
performance INIS
100
bonding INIS
100
liquids INIS
100
solids INIS
100
low temperature INIS
66
mixing INIS
66
fractures INIS
66
aging INIS
66
pressure range mega... INIS
66
shear strength INIS
33
expansion INIS
33
dynamics INIS
33
values INIS
33
reduction INIS
33
interfaces INIS
33
diffusion INIS
33
distribution INIS
33
data INIS
33
simulation INIS
33
phase transformatio... INIS
33
shear INIS
33
reliability INIS
33
thermal expansion INIS
33
pcb INIS
33
enrichment INIS
33
soldering INIS
33
packaging INIS
33
wettability INIS
Research OutputsResearch Output authored by Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology is tagged with the concept