Preparation and analysis of a flexible curing agent for epoxy resin

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

9 Scopus Citations
View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)2706-2710
Journal / PublicationJournal of Applied Polymer Science
Volume114
Issue number5
Publication statusPublished - 1 Dec 2009

Abstract

A kind of novel aromatic amine bis(4-nonyl-2,5-diamine-penoxyl)alkylate (RAn) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RAn were generated by the nonyls in RAn molecules when temperature was below-350°C. Comparing with other reference resins, the enhancement for toughness of RAn cured-resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RAn after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc.

Research Area(s)

  • Curing agent, Epoxy resin, Flexibilizer, Secondary relaxation