Preparation and analysis of a flexible curing agent for epoxy resin

Y. Yang, Gong Chen, K. M. Liew

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    13 Citations (Scopus)

    Abstract

    A kind of novel aromatic amine bis(4-nonyl-2,5-diamine-penoxyl)alkylate (RAn) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RAn were generated by the nonyls in RAn molecules when temperature was below-350°C. Comparing with other reference resins, the enhancement for toughness of RAn cured-resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RAn after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc.
    Original languageEnglish
    Pages (from-to)2706-2710
    JournalJournal of Applied Polymer Science
    Volume114
    Issue number5
    DOIs
    Publication statusPublished - 1 Dec 2009

    Research Keywords

    • Curing agent
    • Epoxy resin
    • Flexibilizer
    • Secondary relaxation

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