Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni

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Original languageEnglish
Article number123513
Journal / PublicationJournal of Applied Physics
Volume109
Issue number12
Publication statusPublished - 15 Jun 2011
Externally publishedYes

Abstract

Ni3Sn4 grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni3Sn4 and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals. © 2011 American Institute of Physics.

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