Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Article number | 123513 |
Journal / Publication | Journal of Applied Physics |
Volume | 109 |
Issue number | 12 |
Publication status | Published - 15 Jun 2011 |
Externally published | Yes |
Link(s)
Abstract
Ni3Sn4 grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni3Sn4 and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals. © 2011 American Institute of Physics.
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Citation Format(s)
Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni. / Suh, J. O.; Tu, K. N.; Wu, Albert T.; Tamura, N.
In: Journal of Applied Physics, Vol. 109, No. 12, 123513, 15.06.2011.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review