Porosity formation and its effects on mechanical properties of SMT solder joints

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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Author(s)

Detail(s)

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherPubl by IEEE
Pages590-594
ISBN (Print)780309154
Publication statusPublished - 1994

Publication series

Name
ISSN (Electronic)0569-5503

Conference

Title44th Electronic Components & Technology Conference
PlaceUnited States
CityWashington
Period1 - 4 May 1994

Abstract

This paper mainly describes pore formation characteristics in surface mount solder joints and its effect on joint strength. Two PCB boards with 14-lands on each board are used in shear strength test. Several solder pastes and reflow temperature profiles are chosen for the experiments. Porosity in solder joints is detected by X-ray radiographic inspection and its area fraction measured quantitatively by computer image analysis. From this work, it is found that pore formation has a great effect on the shear strength. Different solder pastes and reflow temperature profiles may cause different pore formation and joint strength of solder joints. The area fraction of pores in tested solder joints varies from 0 to 20%, and their shear strengths change from 40 to 17 MPa correspondingly. The expression, σp = σae-kP, is established to relate the shear strength, σp, to the area percentage of porosity, P, in surface mount solder joints.

Citation Format(s)

Porosity formation and its effects on mechanical properties of SMT solder joints. / Xie, D. J.; Chan, Y. C.; Lai, J. K L; Hui, I. K.

Proceedings - Electronic Components and Technology Conference. Publ by IEEE, 1994. p. 590-594.

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review