Plastic strain-induced grain refinement at the nanometer scale in copper
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 5281-5291 |
| Journal / Publication | Acta Materialia |
| Volume | 54 |
| Issue number | 19 |
| Publication status | Published - Nov 2006 |
| Externally published | Yes |
Link(s)
Abstract
Microstructural evolution and grain refinement in pure Cu subjected to surface mechanical attrition treatment (SMAT) were investigated by means of systematic transmission electron microscope observations. Two different mechanisms for plastic strain-induced grain refinement in Cu were identified, corresponding to different levels of strain rate. In the subsurface layer of the SMAT Cu samples with low strain rates, grains are refined via formation of dislocation cells (DCs), transformation of DC walls into sub-boundaries with small misorientations, and evolution of sub-boundaries into highly misoriented grain boundaries. The minimum size of refined grains via this process is about 100 nm. In the top surface layer (thickness
Research Area(s)
- Copper, Grain refinement, Mechanical twinning, Plastic deformation, Strain rate
Citation Format(s)
Plastic strain-induced grain refinement at the nanometer scale in copper. / Wang, K.; Tao, N. R.; Liu, G. et al.
In: Acta Materialia, Vol. 54, No. 19, 11.2006, p. 5281-5291.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
