Physics and materials challenges for lead-free solders

K. N. Tu; A. M. Gusak; M. Li

doi:10.1063/1.1517165

Physics and materials challenges for lead-free solders

K. N. Tu, A. M. Gusak, M. Li

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

366 Citations (Scopus)

Abstract

The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished. © 2003 American Institute of Physics.

Original language	English
Pages (from-to)	1335-1353
Journal	Journal of Applied Physics
Volume	93
Issue number	3
DOIs	https://doi.org/10.1063/1.1517165
Publication status	Published - 1 Feb 2003
Externally published	Yes

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title = "Physics and materials challenges for lead-free solders",

abstract = "The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished. {\textcopyright} 2003 American Institute of Physics.",

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AB - The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished. © 2003 American Institute of Physics.

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JF - Journal of Applied Physics

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Physics and materials challenges for lead-free solders

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