Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing
- Guang Chen
- , Hao Peng
- , Vadim V. Silberschmidt
- , Y. C. Chan
- , Changqing Liu*
- , Fengshun Wu*
*Corresponding author for this work
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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