Abstract
Nowadays, demands for compactness, light weight, and broadband have a great impact on design issues at both component and system levels in wireless communications. Multilayered structures fabricated with low-temperature cofire ceramic (LTCC) technologies have been developed recently in response to these demands. With this trend, double-sided printed circuits using conventional fabrication techniques with lower cost have been receiving plenty of attention. © 2010 IEEE.
| Original language | English |
|---|---|
| Article number | 5568168 |
| Pages (from-to) | 16-21 |
| Journal | IEEE Potentials |
| Volume | 29 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - Sept 2010 |
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