Skip to main navigation Skip to search Skip to main content

Performance enhancement of microwave circuits using parallel-strip line

Research output: Journal Publications and ReviewsRGC 22 - Publication in policy or professional journal

Abstract

Nowadays, demands for compactness, light weight, and broadband have a great impact on design issues at both component and system levels in wireless communications. Multilayered structures fabricated with low-temperature cofire ceramic (LTCC) technologies have been developed recently in response to these demands. With this trend, double-sided printed circuits using conventional fabrication techniques with lower cost have been receiving plenty of attention. © 2010 IEEE.
Original languageEnglish
Article number5568168
Pages (from-to)16-21
JournalIEEE Potentials
Volume29
Issue number5
DOIs
Publication statusPublished - Sept 2010

Fingerprint

Dive into the research topics of 'Performance enhancement of microwave circuits using parallel-strip line'. Together they form a unique fingerprint.

Cite this