@inproceedings{c69d8dd5c2e64b54839b67f1d98398be,
title = "Optimized Power Delivery for 3D IC Technology Using Grind Side Redistribution Layers",
abstract = "This paper addresses the issue of delivering power to high performance 3D stacks such as a processor on cache stack. Through Silicon Vias (TSVs) with their associated keep out zones (KOZ) occupy only a small fraction of the die (",
keywords = "3D IC, Electromigration, IR drop, Power delivery, RDL, TSV",
author = "Menglu Li and Prakash Periasamy and Tu, {K. N.} and Iyer, {Subramanian S.}",
note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to
[email protected].; 66th IEEE Electronic Components and Technology Conference (ECTC 2016) ; Conference date: 31-05-2016 Through 03-06-2016",
year = "2016",
month = aug,
day = "16",
doi = "10.1109/ECTC.2016.217",
language = "English",
isbn = "9781509012039",
volume = "2016-August",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",
pages = "2449--2454",
booktitle = "Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference",
address = "United States",
}