Optimization of the nanotwin-induced zigzag surface of copper by electromigration

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Hsin-Ping Chen
  • Chun-Wei Huang
  • Chun-Wen Wang
  • Wen-Wei Wu
  • Chien-Neng Liao
  • Lih-Juann Chen

Detail(s)

Original languageEnglish
Pages (from-to)2584-2588
Journal / PublicationNanoscale
Volume8
Issue number5
Publication statusPublished - 7 Feb 2016
Externally publishedYes

Abstract

By adding nanotwins to Cu, the surface electromigration (EM) slows down. The atomic mobility of the surface step-edges is retarded by the triple points where a twin meets a free surface to form a zigzag-type surface. We observed that EM can alter the zigzag surface structure to optimize the reduction of EM, according to Le Chatelier's principle. Statistically, the optimal alternation is to change an arbitrary (111)/(hkl) zigzag pair to a pair having a very low index (hkl) plane, especially the (200) plane. Using in situ ultrahigh vacuum and high-resolution transmission electron microscopy, we examined the effects of different zigzag surfaces on the rate of EM. The calculated rate of surface EM can be decreased by a factor of ten.

Bibliographic Note

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Citation Format(s)

Optimization of the nanotwin-induced zigzag surface of copper by electromigration. / Chen, Hsin-Ping; Huang, Chun-Wei; Wang, Chun-Wen; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, King-Ning.

In: Nanoscale, Vol. 8, No. 5, 07.02.2016, p. 2584-2588.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review