Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 124-134 |
Journal / Publication | Applied Thermal Engineering |
Volume | 65 |
Issue number | 1-2 |
Publication status | Published - Apr 2014 |
Externally published | Yes |
Link(s)
Abstract
The tendency of increasing power rating and shrinking size of power electronics systems requires advanced thermal management technology. Introduction of micro-channel heat sink into power electronics cooling has significantly improved the cooling performance. In present work, two advanced micro-channel structures, i.e. double-layer (DL) and double-side (sandwich) with water as coolant, are optimized and compared by computational fluid dynamics (CFD) study. The micro-channels are integrated inside the Cu-layer of direct bond copper (DBC). The effects of inlet velocity, inlet temperature, heat flux are investigated during geometry optimization. The major scaling effects including temperature-dependent fluid properties and entrance effect are considered. Based on the optimal geometry, the sandwich structure with counter flow shows a reduction in thermal resistance by 59%, 52% and 53% compared with single-layer (SL), DL with unidirectional flow and DL with counter flow respectively. Water based Al2O3 (with concentration of 1% and 5%) nanofluid is further applied which shows remarkable improvement for wide channels. © 2014 Elsevier B.V. All rights reserved.
Research Area(s)
- CFD, Direct bond copper, Micro-channel heat sink, Nanofluid, Power electronic cooling
Citation Format(s)
Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling. / Sakanova, Assel; Yin, Shan; Zhao, Jiyun et al.
In: Applied Thermal Engineering, Vol. 65, No. 1-2, 04.2014, p. 124-134.
In: Applied Thermal Engineering, Vol. 65, No. 1-2, 04.2014, p. 124-134.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review