Optimal burn-in decision making
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 417-423 |
| Journal / Publication | Quality and Reliability Engineering International |
| Volume | 14 |
| Issue number | 6 |
| Publication status | Published - Nov 1998 |
| Externally published | Yes |
Link(s)
Abstract
This paper presents a conceptual model of burn-in decision making which gives an optimal burn-in time for semiconductor devices and describes how burn-in affects total yield and reliability. For the gate oxide of integrated circuits we consider four burn-in policies: no burn-in, wafer-level bum-in only, package-level burn-in only and wafer-level burn-in prior to package-level burn-in. A decision-making model to minimize cost is given for each burn-in policy. Burn-in time is strongly limited by the cost factor and reliability requirements. In order to reduce the cost incurred in burn-in, a short test time and small test samples are recommended. © 1998 John Wiley & Sons, Ltd.
Research Area(s)
- Burn-in, Package-level burn-in, Semiconductor devices, Wafer-level burn-in
Citation Format(s)
Optimal burn-in decision making. / Kim, Taeho; Kuo, Way.
In: Quality and Reliability Engineering International, Vol. 14, No. 6, 11.1998, p. 417-423.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
