Optical Printed Circuit Board and Its Fabrication Method

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

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Author(s)

Related Research Unit(s)

Detail(s)

Original languageEnglish
Patent numberUS11,071,199
Filing number16/154,933
Publication status
  • Accepted/In press/Filed - 9 Oct 2018
  • Published - 20 Jul 2021

Citation Format(s)

Optical Printed Circuit Board and Its Fabrication Method. / CHIANG, Kin Seng (Inventor); JIN, Wei (Inventor); LOR, Kar Pong (Inventor); CHAN, Hau Ping Andy (Inventor).

Patent No.: US11,071,199. Jul 20, 2021.

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)