Open Innovation and Intellectual Property Issues of 3D Printing

Research output: Conference Papers › RGC 33 - Other conference paper › peer-review

Original language	English
Publication status	Presented - 3 Aug 2018
Event	10th IP Seminar: Intellectual Capital and Intangibles in an Innovation Century - Chinese University of Hong Kong, Hong Kong, China Duration: 2 Aug 2018 → 3 Aug 2018 http://uscipi.com/Events/2018_HK_Seminar/Display_Board_2018_Final.jpg

Conference	10th IP Seminar
Place	Hong Kong, China
Period	2/08/18 → 3/08/18
Internet address	http://uscipi.com/Events/2018_HK_Seminar/Display_Board_2018_Final.jpg

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

@conference{c8a3ed2bea38430e98e41b3e0b93f583,

title = "Open Innovation and Intellectual Property Issues of 3D Printing",

author = "Tianxiang HE",

year = "2018",

month = aug,

day = "3",

language = "English",

note = "10th IP Seminar : Intellectual Capital and Intangibles in an Innovation Century ; Conference date: 02-08-2018 Through 03-08-2018",

url = "http://uscipi.com/Events/2018\_HK\_Seminar/Display\_Board\_2018\_Final.jpg",

}