Open Innovation and Intellectual Property Issues of 3D Printing

Research output: Conference Papers (RGC: 31A, 31B, 32, 33)33_Other conference paper

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Author(s)

Related Research Unit(s)

Detail(s)

Original languageEnglish
Publication statusPresented - 3 Aug 2018

Conference

Title10th IP Seminar
LocationChinese University of Hong Kong
PlaceHong Kong
Period2 - 3 August 2018

Citation Format(s)

Open Innovation and Intellectual Property Issues of 3D Printing. / HE, Tianxiang.

2018. 10th IP Seminar, Hong Kong.

Research output: Conference Papers (RGC: 31A, 31B, 32, 33)33_Other conference paper