Observation of atomic diffusion at twin-modified grain boundaries in copper

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Kuan-Chia Chen
  • Wen-Wei Wu
  • Chien-Neng Liao
  • Lih-Juann Chen
  • K. N. Tu

Detail(s)

Original languageEnglish
Pages (from-to)1066-1069
Journal / PublicationScience
Volume321
Issue number5892
Publication statusPublished - 22 Aug 2008
Externally publishedYes

Abstract

Grain boundaries affect the migration of atoms and electrons in polycrystalline solids, thus influencing many of the mechanical and electrical properties. By introducing nanometer-scale twin defects into copper grains, we show that we can change the grain-boundary structure and atomic-diffusion behavior along the boundary. Using in situ ultrahigh-vacuum and high-resolution transmission electron microscopy, we observed electromigration-induced atomic diffusion in the twin-modified grain boundaries. The triple point where a twin boundary meets a grain boundary was found to slow down grain-boundary and surface electromigration by one order of magnitude. We propose that this occurs because of the incubation time of nucleation of a new step at the triple points. The long incubation time slows down the overall rate of atomic transport.

Bibliographic Note

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Citation Format(s)

Observation of atomic diffusion at twin-modified grain boundaries in copper. / Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N.

In: Science, Vol. 321, No. 5892, 22.08.2008, p. 1066-1069.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review