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Novel approach to surface imaging

  • Mark A. Spak
  • , Fred Mohr
  • , Ronald Bradbury
  • , Ralph R. Dammel
  • , Jason W. Weigold
  • , Stella W. Pang

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

In the past, a number of authors have described the advantages of the silylation reaction performed in a novolak resist's latent image. Both the advantages and difficulties were described. A process based on silylation of latent images was shown to improve the working resolution in a novolak resist due to the surface imaging principle. The difficulties included swelling of the resist film during silylation resulting in some loss of dimensional control of critical dimensions. This paper describes a different approach to near surface imaging. The method relies on the use of spin-on, closely planarizing polymeric antireflective coating, such as AZ®BARLi® coating, followed by imaging thin (less than 0.5 micron) i-line resist. After a conventional lithographic process which includes a wet develop step, a silylation reaction is performed. Swelling of the real resist image due to silylation is controllable within necessary tolerances. Image transfer process of the silylated image is also described. ©2003 Copyright SPIE - The International Society for Optical Engineering.
Original languageEnglish
Pages (from-to)1017-1023
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3333
DOIs
Publication statusPublished - 1998
Externally publishedYes
EventAdvances in Resist Technology and Processing XV - Santa Clara, CA, United States
Duration: 23 Feb 199823 Feb 1998

Research Keywords

  • Bilayer resist
  • DNQ/novolak resist
  • Dry etch image transfer
  • Liquid phase silylation

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