Nondestructive Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)163-168
Journal / PublicationIEEE Transactions on Advanced Packaging
Issue number2
Publication statusPublished - May 2001


Flip chip technology is the emerging interconnect technology for the next generation of high performance electronics. One of the important criteria for reliability is the width of the gap between the die and the substrate, i.e., the standoff height. A nondestructive technique using scanning acoustic microscopy (SAM) for the standoff height measurement of flip chip assemblies is demonstrated. The method, by means of the implementation of a pulse separation technique, time difference of the representative signals of the die bottom and water interface and water and substrate surface interface from the A-scan image can be found. Then, the corresponding standoff height can be calculated. When compared to the traditional destructive measurement method (SEM analysis on sectioned sample), this nondestructive technique yields reliable results.

Research Area(s)

  • Filler particles, Flip chip, Nondestructive, Scanning acoustic microscope, Standoff height, Underfill