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Nanoparticle-enabled selective electrodeposition

  • Hsien-Ping Feng
  • , Trilochan Paudel
  • , Bo Yu
  • , Shuo Chen
  • , Zhi Feng Ren
  • , Gang Chen

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Original languageEnglish
Pages (from-to)2454-2459
JournalAdvanced Materials
Volume23
Issue number21
DOIs
Publication statusPublished - 3 Jun 2011
Externally publishedYes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

  • adhesion
  • conductive glasses
  • electroplating
  • nanoparticles
  • nanosphere lithography

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