Abstract
Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
| Original language | English |
|---|---|
| Pages (from-to) | 2454-2459 |
| Journal | Advanced Materials |
| Volume | 23 |
| Issue number | 21 |
| DOIs | |
| Publication status | Published - 3 Jun 2011 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Research Keywords
- adhesion
- conductive glasses
- electroplating
- nanoparticles
- nanosphere lithography
Fingerprint
Dive into the research topics of 'Nanoparticle-enabled selective electrodeposition'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver