Nanoarray-Embedded Hierarchical Surfaces for Highly Durable Dropwise Condensation
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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Detail(s)
Original language | English |
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Article number | 9789657 |
Journal / Publication | Research |
Volume | 2022 |
Online published | 10 Aug 2022 |
Publication status | Published - 2022 |
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DOI | DOI |
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Link to Scopus | https://www.scopus.com/record/display.uri?eid=2-s2.0-85140211699&origin=recordpage |
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(d8b8e252-bd13-41c2-aefc-9c4c961147e3).html |
Abstract
Durable dropwise condensation of saturated vapor is of significance for heat transfer and energy saving in extensive industrial applications. While numerous superhydrophobic surfaces can promote steam condensation, maintaining discrete microdroplets on surfaces without the formation of a flooded filmwise condensation at high subcooling remains challenging. Here, we report the development of carbon nanotube array-embedded hierarchical composite surfaces that enable ultra-durable dropwise condensation under a wide range of subcooling (ΔTsub = 8 K – 38 K), which outperforms existing nanowire surfaces. This performance stems from the combined strategies of the hydrophobic nanostructures that allow efficient surface renewal and the patterned hydrophilic micro frames that protect the nanostructures and also accelerate droplet nucleation. The synergistic effects of the composite design ensure sustained Cassie wetting mode and capillarity-governed droplet mobility (Bond number < 0:055) as well as the large specific volume of condensed droplets, which contributes to the enhanced condensation heat transfer. Our design provides a feasible alternative for efficiently transferring heat in a vapor environment with relatively high temperatures through the tunable multiscale morphology.
Citation Format(s)
Nanoarray-Embedded Hierarchical Surfaces for Highly Durable Dropwise Condensation. / Hu, Yue; Jiang, Kaili; Liew, Kim Meow et al.
In: Research, Vol. 2022, 9789657, 2022.
In: Research, Vol. 2022, 9789657, 2022.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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