TY - JOUR
T1 - Motion of W marker during sequential compound formation in bimetallic AlCu thin films
AU - Hentzell, H. T.G.
AU - Thompson, R. D.
AU - Tu, K. N.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1983/10
Y1 - 1983/10
N2 - Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse. © 1983.
AB - Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse. © 1983.
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U2 - 10.1016/0167-577X(83)90041-1
DO - 10.1016/0167-577X(83)90041-1
M3 - RGC 21 - Publication in refereed journal
SN - 0167-577X
VL - 2
SP - 81
EP - 84
JO - Materials Letters
JF - Materials Letters
IS - 2
ER -