Morphology, growth and size distribution of Cu 6Sn 5 intermetallic compound by flux-driven ripening at SnPb solder and Cu interface

J. O. Suh, K. N. Tu, A. M. Gusak

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

Abstract

The Size distribution and growth of scallop-type Cu 6Sn 5 intermetallic compound at the interface between molten SnPb solder and Cu was investigated, along with morphological change of Cu 6Sn 5 according to SnPb solder composition. Cu 6Sn 5 showed round scallop-type morphology when SnPb solder composition was from eutectic (63Sn37Pb) to about 40Sn60Pb. In other compositions, the intermetallic compounds showed faceted morphology. This change of morphology is due to variation of interfacial energy with solder composition. The scallop growth rate is proportional to cube root of time, and size distribution is in good agreement with the Flux-Driven-Ripening (FDR) theory. Comparison with other works showed that intermetallic compound scallops with shape close to hemisphere give better agreement with the FDR theory. © 2005 IEEE.
Original languageEnglish
Title of host publicationProceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Pages27-32
Volume2005
DOIs
Publication statusPublished - 2005
Externally publishedYes
Event10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States
Duration: 16 Mar 200518 Mar 2005

Publication series

NameProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Volume2005

Conference

Conference10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
PlaceUnited States
CityIrvine, CA
Period16/03/0518/03/05

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