Morphology change, size distribution, and nano-sized channels in Cu 6Sn 5 intermetallic compound formation at the SnPb solder and copper interface

J. O. Suh; K. N. Tu; A. M. Gusak

doi:10.1557/proc-863-b10.3

Author(s)

J. O. Suh
K. N. Tu
A. M. Gusak

Detail(s)

Original language	English
Article number	B10.3
Pages (from-to)	375-380
Journal / Publication	Materials Research Society Symposium Proceedings
Volume	863
Publication status	Published - 2005
Externally published	Yes

Conference

Title	2005 Materials Research Society Spring Meeting
Place	United States
City	San Francisco, CA
Period	28 March - 1 April 2005

Link(s)

DOI	DOI https://doi.org/10.1557/proc-863-b10.3 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-28844481540&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(a08de970-1ccb-4266-b602-07d5f1f24007).html

Abstract

The growth and size distribution of scallop-type Cu ₆Sn ₅ intermetallic compound (IMC) at the interface between molten SnPb solder and Cu was investigated, along with a systematic study of morphology change of Cu ₆Sn ₅ morphology change as a function of SnPb solder composition. When SnPb solder composition was changed from eutectic (63Sn37Pb) to about 40Sn60Pb, CueSn5 with round scallop-type morphology was found. In other compositions, the Cu ₆Sn ₅ scallops showed faceted scallop-type morphology. This morphological change is due to variation of interfacial energy between Cu ₆Sn ₅ and solder with a change of solder composition. The growth rate of Cu ₆Sn ₅ layer was proportional to cube root of time, and size distribution was in good agreement with the Flux-Driven-Ripening (FOR) theory. The pre-exponent factor k obtained by the measurement was 2.10×10 ^-4 cm ³/sec. Based on the k value, the calculated channel width with was about 2 nm, which was in good agreement with experimental observation by transmission electron microscopy. © 2005 Materials Research Society.

Bibliographic Note

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Citation Format(s)

[ RIS ] [ BibTeX ]

Morphology change, size distribution, and nano-sized channels in Cu ₆Sn ₅ intermetallic compound formation at the SnPb solder and copper interface. / Suh, J. O.; Tu, K. N.; Gusak, A. M.
In: Materials Research Society Symposium Proceedings, Vol. 863, B10.3, 2005, p. 375-380.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Suh, JO, Tu, KN & Gusak, AM 2005, 'Morphology change, size distribution, and nano-sized channels in Cu ₆Sn ₅ intermetallic compound formation at the SnPb solder and copper interface', Materials Research Society Symposium Proceedings, vol. 863, B10.3, pp. 375-380. https://doi.org/10.1557/proc-863-b10.3

Suh, J. O., Tu, K. N., & Gusak, A. M. (2005). Morphology change, size distribution, and nano-sized channels in Cu ₆Sn ₅ intermetallic compound formation at the SnPb solder and copper interface. Materials Research Society Symposium Proceedings, 863, 375-380. Article B10.3. https://doi.org/10.1557/proc-863-b10.3

Suh JO, Tu KN, Gusak AM. Morphology change, size distribution, and nano-sized channels in Cu ₆Sn ₅ intermetallic compound formation at the SnPb solder and copper interface. Materials Research Society Symposium Proceedings. 2005;863:375-380. B10.3. doi: 10.1557/proc-863-b10.3

Suh, J. O. ; Tu, K. N. ; Gusak, A. M. / Morphology change, size distribution, and nano-sized channels in Cu ₆Sn ₅ intermetallic compound formation at the SnPb solder and copper interface. In: Materials Research Society Symposium Proceedings. 2005 ; Vol. 863. pp. 375-380.