TY - JOUR
T1 - Morphology change, size distribution, and nano-sized channels in Cu 6Sn 5 intermetallic compound formation at the SnPb solder and copper interface
AU - Suh, J. O.
AU - Tu, K. N.
AU - Gusak, A. M.
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PY - 2005
Y1 - 2005
N2 - The growth and size distribution of scallop-type Cu 6Sn 5 intermetallic compound (IMC) at the interface between molten SnPb solder and Cu was investigated, along with a systematic study of morphology change of Cu 6Sn 5 morphology change as a function of SnPb solder composition. When SnPb solder composition was changed from eutectic (63Sn37Pb) to about 40Sn60Pb, CueSn5 with round scallop-type morphology was found. In other compositions, the Cu 6Sn 5 scallops showed faceted scallop-type morphology. This morphological change is due to variation of interfacial energy between Cu 6Sn 5 and solder with a change of solder composition. The growth rate of Cu 6Sn 5 layer was proportional to cube root of time, and size distribution was in good agreement with the Flux-Driven-Ripening (FOR) theory. The pre-exponent factor k obtained by the measurement was 2.10×10 -4 cm 3/sec. Based on the k value, the calculated channel width with was about 2 nm, which was in good agreement with experimental observation by transmission electron microscopy. © 2005 Materials Research Society.
AB - The growth and size distribution of scallop-type Cu 6Sn 5 intermetallic compound (IMC) at the interface between molten SnPb solder and Cu was investigated, along with a systematic study of morphology change of Cu 6Sn 5 morphology change as a function of SnPb solder composition. When SnPb solder composition was changed from eutectic (63Sn37Pb) to about 40Sn60Pb, CueSn5 with round scallop-type morphology was found. In other compositions, the Cu 6Sn 5 scallops showed faceted scallop-type morphology. This morphological change is due to variation of interfacial energy between Cu 6Sn 5 and solder with a change of solder composition. The growth rate of Cu 6Sn 5 layer was proportional to cube root of time, and size distribution was in good agreement with the Flux-Driven-Ripening (FOR) theory. The pre-exponent factor k obtained by the measurement was 2.10×10 -4 cm 3/sec. Based on the k value, the calculated channel width with was about 2 nm, which was in good agreement with experimental observation by transmission electron microscopy. © 2005 Materials Research Society.
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U2 - 10.1557/proc-863-b10.3
DO - 10.1557/proc-863-b10.3
M3 - RGC 21 - Publication in refereed journal
SN - 0272-9172
VL - 863
SP - 375
EP - 380
JO - Materials Research Society Symposium Proceedings
JF - Materials Research Society Symposium Proceedings
M1 - B10.3
T2 - 2005 Materials Research Society Spring Meeting
Y2 - 28 March 2005 through 1 April 2005
ER -