Morphology and orientation evolution of Cu6Sn5 grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient

Yuanyuan Qiao; Xiaoying Liu; Ning Zhao; Lawrence C M Wu; Chungying Liu

doi:10.1016/j.jmst.2021.03.065

Author(s)

Yuanyuan Qiao
Xiaoying Liu
Ning Zhao
Lawrence C M Wu
Chungying Liu

Related Research Unit(s)

Department of Materials Science and Engineering

Detail(s)

Original language	English
Pages (from-to)	29-39
Number of pages	11
Journal / Publication	Journal of Materials Science and Technology
Volume	95
Online published	24 May 2021
Publication status	Published - 30 Dec 2021

Link(s)

DOI	DOI https://doi.org/10.1016/j.jmst.2021.03.065 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-85107276197&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(6a2cfbd0-aa22-4675-8a87-a3abf09328af).html

Abstract

The morphology and orientation evolution of Cu₆Sn₅ grains formed on (001)Cu and (011)Cu single crystal substrates under temperature gradient (TG) were investigated. The initial orientated prism-type Cu₆Sn₅ grains transformed to non-orientated scallop-type after isothermal reflow. However, the Cu₆Sn₅ grains with strong texture were revealed on cold end single crystal Cu substrates by imposing TG. The Cu₆Sn₅ grains on (001)Cu grew along their c-axis parallel to the substrate and finally merged into one grain to form a fully IMC joint, while those on (011)Cu presented a strong texture and merged into a few dominant Cu₆Sn₅ grains showing about 30° angle with the substrate. The merging between neighboring Cu₆Sn₅ grain pair was attributed to the rapid grain growth and grain boundary migration. Accordingly, a model was put forward to describe the merging process. The different morphology and orientation evolutions of the Cu₆Sn₅ grains on single crystal and polycrystal Cu substrates were revealed based on crystallographic relationship and Cu flux. The method for controlling the morphology and orientation of Cu₆Sn₅ grains is really benefitial to solve the reliability problems caused by anisotropy in 3D packaging.

Research Area(s)

3D packaging, Single crystal Cu, Temperature gradient, Orientation, Disregistry, Grain boundary migration

Citation Format(s)

[ RIS ] [ BibTeX ]

Morphology and orientation evolution of Cu₆Sn₅ grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient. / Qiao, Yuanyuan; Liu, Xiaoying; Zhao, Ning et al.
In: Journal of Materials Science and Technology, Vol. 95, 30.12.2021, p. 29-39.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Qiao, Y, Liu, X, Zhao, N, Wu, LCM & Liu, C 2021, 'Morphology and orientation evolution of Cu₆Sn₅ grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient', Journal of Materials Science and Technology, vol. 95, pp. 29-39. https://doi.org/10.1016/j.jmst.2021.03.065

Qiao, Y., Liu, X., Zhao, N., Wu, L. C. M., & Liu, C. (2021). Morphology and orientation evolution of Cu₆Sn₅ grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient. Journal of Materials Science and Technology, 95, 29-39. https://doi.org/10.1016/j.jmst.2021.03.065

Qiao Y, Liu X, Zhao N, Wu LCM, Liu C. Morphology and orientation evolution of Cu₆Sn₅ grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient. Journal of Materials Science and Technology. 2021 Dec 30;95:29-39. Epub 2021 May 24. doi: 10.1016/j.jmst.2021.03.065

Qiao, Yuanyuan ; Liu, Xiaoying ; Zhao, Ning et al. / Morphology and orientation evolution of Cu₆Sn₅ grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient. In: Journal of Materials Science and Technology. 2021 ; Vol. 95. pp. 29-39.