Abstract
Anisotropic conductive films (ACF), a flip chip interconnection material, offers high density I/O interconnection and low processing temperature. ACF materials are widely used in smart cards, disk drives and driver chips for LCDs. It consist of adhesive and conductive particles. The reliability of ACF is strongly affected by moisture and is a major factor in ACF flip chip failures. Electrical conduction through ACF is achieved by the mechanical deformation of tiny conductive particles contained within the cured adhesives.
| Original language | English |
|---|---|
| Pages (from-to) | 20-24 |
| Journal | Electronics World |
| Volume | 111 |
| Issue number | 1836 |
| Publication status | Published - Dec 2005 |
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