Modeling and plasma characteristics of high-power direct current discharge

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

6 Scopus Citations
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Author(s)

  • Lei Chen
  • Suihan Cui
  • Wei Tang
  • Lin Zhou
  • Tijun Li
  • Xiaokai An
  • Zhongcan Wu
  • Zhengyong Ma
  • Hai Lin
  • Xiubo Tian
  • Ricky Ky Fu
  • Zhongzhen Wu

Detail(s)

Original languageEnglish
Article number025016
Journal / PublicationPlasma Sources Science and Technology
Volume29
Issue number2
Online published14 Feb 2020
Publication statusPublished - Feb 2020

Link(s)

Abstract

To obtain both high ionization and high deposition rate, a modified global model for a continuous high-power DC magnetron sputtering (C-HPMS) is established by considering the continuous generation of the hot electrons and the high temperature caused by continuous high-power discharge. The results show that the plasma density is on the order of 1019 m-3 for power densities of only 183 W cm-2 (Al) and 117 W cm-2 (Cu). The ionization rate exceeds 90% of high-power impulse magnetron sputtering (HiPIMS) (peak power density of 564 W cm-2) for a DC power density of 180 W cm-2, and the total diffusion fluxes of the two targets are 26 (Al) and 30 (Cu) times that of conventional HiPIMS, leading to very high deposition rates. The work provides a theoretical basis for the realization of C-HPMS and gives an enlightenment to the development of deposition equipment for continuous high-power discharges.

Research Area(s)

  • deposition rate, ionization rate, sputtering-HPMS, thermal accumulation

Citation Format(s)

Modeling and plasma characteristics of high-power direct current discharge. / Chen, Lei; Cui, Suihan; Tang, Wei; Zhou, Lin; Li, Tijun; Liu, Liangliang; An, Xiaokai; Wu, Zhongcan; Ma, Zhengyong; Lin, Hai; Tian, Xiubo; Fu, Ricky Ky; Chu, Paul K; Wu, Zhongzhen.

In: Plasma Sources Science and Technology, Vol. 29, No. 2, 025016, 02.2020.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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