TY - JOUR
T1 - Modeling and control of time-pressure dispensing for semiconductor manufacturing
AU - Chen, Cong-Ping
AU - Li, Han-Xiong
AU - Ding, Han
PY - 2007/10
Y1 - 2007/10
N2 - To improve the consistency of the adhesive amount dispensed by the time-pressure dispenser for semiconductor manufacturing, a non-Newtonian fluid flow rate model is developed to represent and estimate the adhesive amount dispensed in each cycle. Taking account of gas compressibility, an intelligent model-based control strategy is proposed to compensate the deviation of adhesive amount dispensed from the desired one. Both simulations and experiments show that the dispensing consistency is greatly improved by using the model-based control strategy developed in this paper. © 2007 Institute of Automation, Chinese Academy of Sciences.
AB - To improve the consistency of the adhesive amount dispensed by the time-pressure dispenser for semiconductor manufacturing, a non-Newtonian fluid flow rate model is developed to represent and estimate the adhesive amount dispensed in each cycle. Taking account of gas compressibility, an intelligent model-based control strategy is proposed to compensate the deviation of adhesive amount dispensed from the desired one. Both simulations and experiments show that the dispensing consistency is greatly improved by using the model-based control strategy developed in this paper. © 2007 Institute of Automation, Chinese Academy of Sciences.
KW - Consistency
KW - Fluid flow rate model
KW - Model-based control
KW - Time-pressure dispensing
UR - http://www.scopus.com/inward/record.url?scp=35148853994&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-35148853994&origin=recordpage
U2 - 10.1007/s11633-007-0422-8
DO - 10.1007/s11633-007-0422-8
M3 - RGC 21 - Publication in refereed journal
SN - 1476-8186
VL - 4
SP - 422
EP - 427
JO - International Journal of Automation and Computing
JF - International Journal of Automation and Computing
IS - 4
ER -
