Mirror coating and packaging for a horizontal MEMS optical switch array

M. Li; P. S. Chung; M. T. Yeung; P. S. Chan; T. K. Liang; C. Shu; K. W C Lai; W. J. Li; F. Long; H. K. Tsang

doi:10.1109/ECTC.2004.1320295

Mirror coating and packaging for a horizontal MEMS optical switch array

M. Li
, P. S. Chung
, M. T. Yeung
, P. S. Chan
, T. K. Liang
, C. Shu
, K. W C Lai
, W. J. Li
, F. Long
, H. K. Tsang

Research output: Journal Publications and Reviews › RGC 22 - Publication in policy or professional journal

Abstract

A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acted as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.

Original language	English
Pages (from-to)	1400-1405
Journal	Proceedings - Electronic Components and Technology Conference
Volume	2
DOIs	https://doi.org/10.1109/ECTC.2004.1320295
Publication status	Published - 2004
Externally published	Yes
Event	54^th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: 1 Jun 2004 → 4 Jun 2004

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@article{357682add00041d995de2fca2a7d605a,

title = "Mirror coating and packaging for a horizontal MEMS optical switch array",

abstract = "A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acted as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.",

author = "M. Li and Chung, \{P. S.\} and Yeung, \{M. T.\} and Chan, \{P. S.\} and Liang, \{T. K.\} and C. Shu and Lai, \{K. W C\} and Li, \{W. J.\} and F. Long and Tsang, \{H. K.\}",

year = "2004",

doi = "10.1109/ECTC.2004.1320295",

language = "English",

volume = "2",

pages = "1400--1405",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "IEEE",

note = "54<sup>th</sup> Electronic Components and Technology Conference ; Conference date: 01-06-2004 Through 04-06-2004",

}

TY - JOUR

T1 - Mirror coating and packaging for a horizontal MEMS optical switch array

AU - Li, M.

AU - Chung, P. S.

AU - Yeung, M. T.

AU - Chan, P. S.

AU - Liang, T. K.

AU - Shu, C.

AU - Lai, K. W C

AU - Li, W. J.

AU - Long, F.

AU - Tsang, H. K.

PY - 2004

Y1 - 2004

N2 - A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acted as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.

AB - A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acted as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.

UR - https://www.scopus.com/pages/publications/10444258014

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-10444258014&origin=recordpage

U2 - 10.1109/ECTC.2004.1320295

DO - 10.1109/ECTC.2004.1320295

M3 - RGC 22 - Publication in policy or professional journal

SN - 0569-5503

VL - 2

SP - 1400

EP - 1405

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 54<sup>th</sup> Electronic Components and Technology Conference

Y2 - 1 June 2004 through 4 June 2004

ER -

Mirror coating and packaging for a horizontal MEMS optical switch array

Abstract

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