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Microwave packaging of high-speed semiconductor lasers

  • N. H. Zhu*
  • , S. J. Zhang
  • , C. Chen
  • , Y. Liu
  • , C. Liu
  • , E. Y. B. Pun
  • , P. S. Chung
  • *Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Many new and different packaging types of high-speed semiconductor lasers have been developed to meet the rapidly increasing demand. This paper describes the recent progress in the microwave issues of high-speed semiconductor laser packaging. © 2005 Optical Society of America.
Original languageEnglish
Title of host publicationIntegrated Photonics Research and Applications 2005
PublisherOptical Society of America (OSA)
ISBN (Print)1557527873, 9781557527875
DOIs
Publication statusPublished - Apr 2005
EventIntegrated Photonics Research and Applications 2005 (IPRA 2005) - San Diego, United States
Duration: 10 Apr 2005 → 13 Apr 2005

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Conference

ConferenceIntegrated Photonics Research and Applications 2005 (IPRA 2005)
PlaceUnited States
CitySan Diego
Period10/04/05 → 13/04/05

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