Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

G. Z. Pan; Ann A. Liu; H. K. Kim; K. N. Tu; Paul A. Totta

doi:10.1063/1.120224

Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

G. Z. Pan, Ann A. Liu, H. K. Kim, K. N. Tu, Paul A. Totta

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

50 Citations (Scopus)

Abstract

The microstructure of phased-in Cr-Cu/Cu/Au multilayer thin films and their solderability with high Pb-content PbSn solder (95/5%) and eutectic PbSn solder (37/63%) were studied by using cross-sectional transmission electron microscopy and scanning electron microscopy. We found that the phased-in Cr-Cu layer is intermixed and grains of both Cr and Cu are elongated along the growth direction. This special compositionally graded or functionally graded microstructure presents a lock-in effect of the Cr and Cu grains. It has succeeded in preventing the spalling of Cu₃Sn in solder joints formed using the 95/5% solder, but failed in preventing the spalling of Cu₆Sn₅ in those formed using the eutectic solder. We suggest that the difference may be due to the different dissolution rates of the two compounds in the solders. © 1997 American Institute of Physics.

Original language	English
Pages (from-to)	2946-2948
Journal	Applied Physics Letters
Volume	71
Issue number	20
DOIs	https://doi.org/10.1063/1.120224
Publication status	Published - 17 Nov 1997
Externally published	Yes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Access Output

10.1063/1.120224

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{c23280e348b8452b8bedc51d4410311b,

title = "Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders",

abstract = "The microstructure of phased-in Cr-Cu/Cu/Au multilayer thin films and their solderability with high Pb-content PbSn solder (95/5%) and eutectic PbSn solder (37/63%) were studied by using cross-sectional transmission electron microscopy and scanning electron microscopy. We found that the phased-in Cr-Cu layer is intermixed and grains of both Cr and Cu are elongated along the growth direction. This special compositionally graded or functionally graded microstructure presents a lock-in effect of the Cr and Cu grains. It has succeeded in preventing the spalling of Cu3Sn in solder joints formed using the 95/5% solder, but failed in preventing the spalling of Cu6Sn5 in those formed using the eutectic solder. We suggest that the difference may be due to the different dissolution rates of the two compounds in the solders. {\textcopyright} 1997 American Institute of Physics.",

author = "Pan, {G. Z.} and Liu, {Ann A.} and Kim, {H. K.} and Tu, {K. N.} and Totta, {Paul A.}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ",

year = "1997",

month = nov,

day = "17",

doi = "10.1063/1.120224",

language = "English",

volume = "71",

pages = "2946--2948",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

number = "20",

}

Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders. / Pan, G. Z.; Liu, Ann A.; Kim, H. K. et al.
In: Applied Physics Letters, Vol. 71, No. 20, 17.11.1997, p. 2946-2948.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

AU - Pan, G. Z.

AU - Liu, Ann A.

AU - Kim, H. K.

AU - Tu, K. N.

AU - Totta, Paul A.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 1997/11/17

Y1 - 1997/11/17

N2 - The microstructure of phased-in Cr-Cu/Cu/Au multilayer thin films and their solderability with high Pb-content PbSn solder (95/5%) and eutectic PbSn solder (37/63%) were studied by using cross-sectional transmission electron microscopy and scanning electron microscopy. We found that the phased-in Cr-Cu layer is intermixed and grains of both Cr and Cu are elongated along the growth direction. This special compositionally graded or functionally graded microstructure presents a lock-in effect of the Cr and Cu grains. It has succeeded in preventing the spalling of Cu3Sn in solder joints formed using the 95/5% solder, but failed in preventing the spalling of Cu6Sn5 in those formed using the eutectic solder. We suggest that the difference may be due to the different dissolution rates of the two compounds in the solders. © 1997 American Institute of Physics.

AB - The microstructure of phased-in Cr-Cu/Cu/Au multilayer thin films and their solderability with high Pb-content PbSn solder (95/5%) and eutectic PbSn solder (37/63%) were studied by using cross-sectional transmission electron microscopy and scanning electron microscopy. We found that the phased-in Cr-Cu layer is intermixed and grains of both Cr and Cu are elongated along the growth direction. This special compositionally graded or functionally graded microstructure presents a lock-in effect of the Cr and Cu grains. It has succeeded in preventing the spalling of Cu3Sn in solder joints formed using the 95/5% solder, but failed in preventing the spalling of Cu6Sn5 in those formed using the eutectic solder. We suggest that the difference may be due to the different dissolution rates of the two compounds in the solders. © 1997 American Institute of Physics.

UR - http://www.scopus.com/inward/record.url?scp=0001514053&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0001514053&origin=recordpage

U2 - 10.1063/1.120224

DO - 10.1063/1.120224

M3 - RGC 21 - Publication in refereed journal

SN - 0003-6951

VL - 71

SP - 2946

EP - 2948

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 20

ER -

Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

Abstract

Bibliographical note

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this