TY - GEN
T1 - Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
AU - Wu, Albert T.
AU - Lloyd, J. R.
AU - Tamura, N.
AU - Tu, K. N.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2005
Y1 - 2005
N2 - Under constant current electromigration, white tin (β-Sn) exhibited a resistance drop of up to 10%. It has a body-center tetragonal (BCT) structure, and the resistivity along the a and b axes is 35% smaller than that along the c axis. Microstructure evolution under electromigration could be responsible for the resistance drop. Synchrotron radiation white beam x-ray microdiffraction was used to study this evolution. Both stress and grain orientation was studied. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation during electromigration testing in ex-situ and in-situ samples. We observed that high resistance grains re-orient with respect to the neighboring low resistance grains, most likely by grain rotation of the latter. A different mechanism of microstructure evolution under electromigration from the normal grain growth is proposed and discussed. © 2005 IEEE.
AB - Under constant current electromigration, white tin (β-Sn) exhibited a resistance drop of up to 10%. It has a body-center tetragonal (BCT) structure, and the resistivity along the a and b axes is 35% smaller than that along the c axis. Microstructure evolution under electromigration could be responsible for the resistance drop. Synchrotron radiation white beam x-ray microdiffraction was used to study this evolution. Both stress and grain orientation was studied. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation during electromigration testing in ex-situ and in-situ samples. We observed that high resistance grains re-orient with respect to the neighboring low resistance grains, most likely by grain rotation of the latter. A different mechanism of microstructure evolution under electromigration from the normal grain growth is proposed and discussed. © 2005 IEEE.
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U2 - 10.1109/ISAPM.2005.1432073
DO - 10.1109/ISAPM.2005.1432073
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0780390857
SN - 9780780390850
VL - 2005
T3 - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
SP - 178
EP - 180
BT - Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
T2 - 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Y2 - 16 March 2005 through 18 March 2005
ER -