Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on〈1 1 1〉oriented and nanotwinned Cu

Han-wen Lin; Chia-ling Lu; Chien-min Liu; Chih Chen; Delphic Chen; Jui-Chao Kuo; K.N. Tu

doi:10.1016/j.actamat.2013.04.056

Microstructure control of unidirectional growth of η-Cu₆Sn₅ in microbumps on〈1 1 1〉oriented and nanotwinned Cu

Han-wen Lin
, Chia-ling Lu
, Chien-min Liu
, Chih Chen^*
, Delphic Chen
, Jui-Chao Kuo
, K.N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

59 Citations (Scopus)

Abstract

Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of η-Cu₆Sn₅ intermetallic compound in microbumps by using〈1 1 1〉oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of〈1 1 1〉oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form η-Cu ₆Sn₅ in the reflow at 260 °C for 1 min. The η-Cu ₆Sn₅ showed a highly preferential growth along the〈0 0 0 1〉direction. As reflow time is extended, the preferred texture of η-Cu₆Sn₅ changed to {21̄1̄3}. The results indicate that we can control the uniform microstructure of η-Cu₆Sn₅ intermetallic by controlling the microstructure of the Cu under-bump-metallization. © 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	4910-4919
Journal	Acta Materialia
Volume	61
Issue number	13
DOIs	https://doi.org/10.1016/j.actamat.2013.04.056
Publication status	Published - Aug 2013
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Copper
Intermetallic compounds
Soldering

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@article{47764b07e2434fd2ae3ebf2a645684df,

title = "Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on〈1 1 1〉oriented and nanotwinned Cu",

abstract = "Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of η-Cu6Sn5 intermetallic compound in microbumps by using〈1 1 1〉oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of〈1 1 1〉oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form η-Cu 6Sn5 in the reflow at 260 °C for 1 min. The η-Cu 6Sn5 showed a highly preferential growth along the〈0 0 0 1〉direction. As reflow time is extended, the preferred texture of η-Cu6Sn5 changed to \{2{\=1}{\=1}3\}. The results indicate that we can control the uniform microstructure of η-Cu6Sn5 intermetallic by controlling the microstructure of the Cu under-bump-metallization. {\textcopyright} 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.",

keywords = "Copper, Intermetallic compounds, Soldering",

author = "Han-wen Lin and Chia-ling Lu and Chien-min Liu and Chih Chen and Delphic Chen and Jui-Chao Kuo and K.N. Tu",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "2013",

month = aug,

doi = "10.1016/j.actamat.2013.04.056",

language = "English",

volume = "61",

pages = "4910--4919",

journal = "Acta Materialia",

issn = "1359-6454",

publisher = "Elsevier Ltd.",

number = "13",

}

TY - JOUR

T1 - Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on〈1 1 1〉oriented and nanotwinned Cu

AU - Lin, Han-wen

AU - Lu, Chia-ling

AU - Liu, Chien-min

AU - Chen, Chih

AU - Chen, Delphic

AU - Kuo, Jui-Chao

AU - Tu, K.N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2013/8

Y1 - 2013/8

N2 - Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of η-Cu6Sn5 intermetallic compound in microbumps by using〈1 1 1〉oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of〈1 1 1〉oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form η-Cu 6Sn5 in the reflow at 260 °C for 1 min. The η-Cu 6Sn5 showed a highly preferential growth along the〈0 0 0 1〉direction. As reflow time is extended, the preferred texture of η-Cu6Sn5 changed to {21̄1̄3}. The results indicate that we can control the uniform microstructure of η-Cu6Sn5 intermetallic by controlling the microstructure of the Cu under-bump-metallization. © 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

AB - Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of η-Cu6Sn5 intermetallic compound in microbumps by using〈1 1 1〉oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of〈1 1 1〉oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form η-Cu 6Sn5 in the reflow at 260 °C for 1 min. The η-Cu 6Sn5 showed a highly preferential growth along the〈0 0 0 1〉direction. As reflow time is extended, the preferred texture of η-Cu6Sn5 changed to {21̄1̄3}. The results indicate that we can control the uniform microstructure of η-Cu6Sn5 intermetallic by controlling the microstructure of the Cu under-bump-metallization. © 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

KW - Copper

KW - Intermetallic compounds

KW - Soldering

UR - https://www.scopus.com/pages/publications/84879416922

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84879416922&origin=recordpage

U2 - 10.1016/j.actamat.2013.04.056

DO - 10.1016/j.actamat.2013.04.056

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6454

VL - 61

SP - 4910

EP - 4919

JO - Acta Materialia

JF - Acta Materialia

IS - 13

ER -