Abstract
A method, combining micro-contact printing (μCP), wet chemical etching and reactive ion etching (RIE), is reported to fabricate microstructures on Si and SiOx. Positive and negative structures were generated based on different stamps used for μCP. The reproducibility of the obtained microstructures shows the methodology reported herein could be useful in Micro-Electro-Mechanical Systems (MEMS), optical and biological sensing applications.
| Original language | English |
|---|---|
| Pages (from-to) | 1960-1963 |
| Journal | Applied Surface Science |
| Volume | 253 |
| Issue number | 4 |
| Online published | 2 May 2006 |
| DOIs | |
| Publication status | Published - 15 Dec 2006 |
| Externally published | Yes |
Research Keywords
- Micro-contact printing
- Wet chemical etching
- Reactive ion etching
- Silicon
- Silicon oxide
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