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Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration
Yu-An Shen*, Shiqi Zhou, Jiahui Li, K. N. Tu, Hiroshi Nishikawa
*Corresponding author for this work
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
5
Citations
(Scopus)