Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration

Yu-An Shen; Shiqi Zhou; Jiahui Li; K. N. Tu; Hiroshi Nishikawa

doi:10.1109/ECTC.2019.00307

Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration

Yu-An Shen^*, Shiqi Zhou, Jiahui Li, K. N. Tu, Hiroshi Nishikawa

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

5 Citations (Scopus)

Abstract

Thermomigration is very important for electronic packaging. To conduct heat away, it requires a temperature gradient. Just 1°C difference across a microbump of 10 μm in diameter induces a considerable thermal gradient in solder bumps, known as thermomigration, especially in eutectic Sn58Bi solder joints with a low melting point. However, the study of thermormigration in eutectic Sn-58Bi solder joints is rare, not to mention the effect on thermal-stress distribution in Sn-58Bi solder. In this study, Cu/Sn-58Bi/Cu solder joints are examined between different thermogradients of 1284 °C/cm and 890 °C/cm. We found the effect of thermogradients on the microstructures in the Sn-58Bi solders. The considerable Bi accumulations at the cold end and smaller grains formation near the hot end are caused by the higher thermogradient. Conversely, the fewer Bi accumulations at the cold end and grain growth at the hot end are induced by the lower thermogradient. Additionally, phase segregation would lead the crack propagation along the boundary due to the thermal-stress crowding on the phase boundaries. The findings provide a new sight of reliability issues for electronic packaging.

Original language	English
Title of host publication	ECTC The 2019 IEEE 69th Electronic Components and Technology Conference
Subtitle of host publication	Proceedings
Publisher	IEEE
Pages	2003-2008
ISBN (Electronic)	978-1-7281-1499-6
ISBN (Print)	978-1-7281-1500-9
DOIs	https://doi.org/10.1109/ECTC.2019.00307
Publication status	Published - May 2019
Event	69th IEEE Electronic Components and Technology Conference (ECTC 2019) - The Cosmopolitan of Las Vegas, Las Vegas, United States Duration: 28 May 2019 → 31 May 2019 https://www.ectc.net/about/69highlights.cfm

Publication series

Name	Electronic Components and Technology Conference
ISSN (Print)	0569-5503
ISSN (Electronic)	2377-5726

Conference

Conference	69th IEEE Electronic Components and Technology Conference (ECTC 2019)
Place	United States
City	Las Vegas
Period	28/05/19 → 31/05/19
Internet address	https://www.ectc.net/about/69highlights.cfm

Research Keywords

Thermomigration
Sn-Bi solder joint
Phase segregation
Thermal stress
Finite element method (FEM)

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10.1109/ECTC.2019.00307

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Shen, Y.-A., Zhou, S., Li, J., Tu, K. N., & Nishikawa, H. (2019). Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration. In ECTC The 2019 IEEE 69th Electronic Components and Technology Conference: Proceedings (pp. 2003-2008). Article 8811211 (Electronic Components and Technology Conference). IEEE. https://doi.org/10.1109/ECTC.2019.00307

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title = "Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration",

abstract = "Thermomigration is very important for electronic packaging. To conduct heat away, it requires a temperature gradient. Just 1°C difference across a microbump of 10 μm in diameter induces a considerable thermal gradient in solder bumps, known as thermomigration, especially in eutectic Sn58Bi solder joints with a low melting point. However, the study of thermormigration in eutectic Sn-58Bi solder joints is rare, not to mention the effect on thermal-stress distribution in Sn-58Bi solder. In this study, Cu/Sn-58Bi/Cu solder joints are examined between different thermogradients of 1284 °C/cm and 890 °C/cm. We found the effect of thermogradients on the microstructures in the Sn-58Bi solders. The considerable Bi accumulations at the cold end and smaller grains formation near the hot end are caused by the higher thermogradient. Conversely, the fewer Bi accumulations at the cold end and grain growth at the hot end are induced by the lower thermogradient. Additionally, phase segregation would lead the crack propagation along the boundary due to the thermal-stress crowding on the phase boundaries. The findings provide a new sight of reliability issues for electronic packaging.",

keywords = "Thermomigration, Sn-Bi solder joint, Phase segregation, Thermal stress, Finite element method (FEM)",

author = "Yu-An Shen and Shiqi Zhou and Jiahui Li and Tu, {K. N.} and Hiroshi Nishikawa",

year = "2019",

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Shen, Y-A, Zhou, S, Li, J, Tu, KN & Nishikawa, H 2019, Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration. in ECTC The 2019 IEEE 69th Electronic Components and Technology Conference: Proceedings., 8811211, Electronic Components and Technology Conference, IEEE, pp. 2003-2008, 69th IEEE Electronic Components and Technology Conference (ECTC 2019), Las Vegas, Nevada, United States, 28/05/19. https://doi.org/10.1109/ECTC.2019.00307

Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration. / Shen, Yu-An; Zhou, Shiqi; Li, Jiahui et al.
ECTC The 2019 IEEE 69th Electronic Components and Technology Conference: Proceedings. IEEE, 2019. p. 2003-2008 8811211 (Electronic Components and Technology Conference).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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T1 - Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration

AU - Shen, Yu-An

AU - Zhou, Shiqi

AU - Li, Jiahui

AU - Tu, K. N.

AU - Nishikawa, Hiroshi

PY - 2019/5

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N2 - Thermomigration is very important for electronic packaging. To conduct heat away, it requires a temperature gradient. Just 1°C difference across a microbump of 10 μm in diameter induces a considerable thermal gradient in solder bumps, known as thermomigration, especially in eutectic Sn58Bi solder joints with a low melting point. However, the study of thermormigration in eutectic Sn-58Bi solder joints is rare, not to mention the effect on thermal-stress distribution in Sn-58Bi solder. In this study, Cu/Sn-58Bi/Cu solder joints are examined between different thermogradients of 1284 °C/cm and 890 °C/cm. We found the effect of thermogradients on the microstructures in the Sn-58Bi solders. The considerable Bi accumulations at the cold end and smaller grains formation near the hot end are caused by the higher thermogradient. Conversely, the fewer Bi accumulations at the cold end and grain growth at the hot end are induced by the lower thermogradient. Additionally, phase segregation would lead the crack propagation along the boundary due to the thermal-stress crowding on the phase boundaries. The findings provide a new sight of reliability issues for electronic packaging.

AB - Thermomigration is very important for electronic packaging. To conduct heat away, it requires a temperature gradient. Just 1°C difference across a microbump of 10 μm in diameter induces a considerable thermal gradient in solder bumps, known as thermomigration, especially in eutectic Sn58Bi solder joints with a low melting point. However, the study of thermormigration in eutectic Sn-58Bi solder joints is rare, not to mention the effect on thermal-stress distribution in Sn-58Bi solder. In this study, Cu/Sn-58Bi/Cu solder joints are examined between different thermogradients of 1284 °C/cm and 890 °C/cm. We found the effect of thermogradients on the microstructures in the Sn-58Bi solders. The considerable Bi accumulations at the cold end and smaller grains formation near the hot end are caused by the higher thermogradient. Conversely, the fewer Bi accumulations at the cold end and grain growth at the hot end are induced by the lower thermogradient. Additionally, phase segregation would lead the crack propagation along the boundary due to the thermal-stress crowding on the phase boundaries. The findings provide a new sight of reliability issues for electronic packaging.

KW - Thermomigration

KW - Sn-Bi solder joint

KW - Phase segregation

KW - Thermal stress

KW - Finite element method (FEM)

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ER -

Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration

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