TY - JOUR
T1 - Microstructure and mechanical properties of new lead-free Sn-Cu-Re solder alloys
AU - Wu, C.M. Lawrence
AU - Yu, D. Q.
AU - Law, C. M T
AU - Wang, L.
PY - 2002/9
Y1 - 2002/9
N2 - The Sn-0.7%Cu alloy has been considered as a lead-free alternative to lead-tin alloys. In this work, various small amounts of rare earth (RE) elements, which are mainly Ce and La, have been added to the Sn-0.7%Cu alloy to form new solder alloys. It was found that the new alloys exhibit mechanical properties superior to that of the Sn-0.7%Cu alloy. In particular, the addition of up to 0.5% of RE elements is found to refine the effective grain size and provide a fine and uniform distribution of Cu6Sn5 in the solidified microstructure. Tensile, creep, and microhardness tests were conducted on the solder alloys. It was found that significant improvements of the tensile strength, microhardness, and creep resistance were obtained with RE element addition. Upon aging at 150°C for 20 h, the microstructure of Sn-Cu-RE is more stable than that of the Sn-Cu alloy.
AB - The Sn-0.7%Cu alloy has been considered as a lead-free alternative to lead-tin alloys. In this work, various small amounts of rare earth (RE) elements, which are mainly Ce and La, have been added to the Sn-0.7%Cu alloy to form new solder alloys. It was found that the new alloys exhibit mechanical properties superior to that of the Sn-0.7%Cu alloy. In particular, the addition of up to 0.5% of RE elements is found to refine the effective grain size and provide a fine and uniform distribution of Cu6Sn5 in the solidified microstructure. Tensile, creep, and microhardness tests were conducted on the solder alloys. It was found that significant improvements of the tensile strength, microhardness, and creep resistance were obtained with RE element addition. Upon aging at 150°C for 20 h, the microstructure of Sn-Cu-RE is more stable than that of the Sn-Cu alloy.
KW - Aging
KW - Ce and La rare earth elements
KW - Creep
KW - Tensile strength
KW - Tin-copper lead-free alloy
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0036738909&origin=recordpage
M3 - RGC 21 - Publication in refereed journal
SN - 0361-5235
VL - 31
SP - 928
EP - 932
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 9
ER -