TY - JOUR
T1 - Micro fabrication of cyclic olefin copolymer (COC) based microfluidic devices
AU - Jena, Rajeeb K.
AU - Yue, C. Y.
AU - Lam, Y. C.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2012/2
Y1 - 2012/2
N2 - Microfabrication of polymer using hot embossing technique are becoming increasingly important and considered as low-cost alternative to the silicon or glass-based micro-electro-mechanical systems technologies. This report is based on a parametric study on the hot embossing of cyclic olefin copolymer (COC) (Topas-6015 grade). The key process parameters in hot embossing such as the embossing temperature, load, the holding time and the demolding temperature significantly impact the quality of the embossed product. The work was performed to understand the influence of the various process parameters on the embossed micro-size patterns with the aim to develop the capability for microfluidic devices manufacturing. Microembossed polymer replicates were measured using a PLμ confocal microscope and inspected using a scanning electron microscope. It was established that the optimal embossing temperature for COC is 10°C above its T g, while an optimal embossing load of 2.94 kN and holding time of 180 s are required. We have also demonstrated the effective sealing of the microchannel without destroying the channel integrity by thermal bonding technique. © Springer-Verlag 2011.
AB - Microfabrication of polymer using hot embossing technique are becoming increasingly important and considered as low-cost alternative to the silicon or glass-based micro-electro-mechanical systems technologies. This report is based on a parametric study on the hot embossing of cyclic olefin copolymer (COC) (Topas-6015 grade). The key process parameters in hot embossing such as the embossing temperature, load, the holding time and the demolding temperature significantly impact the quality of the embossed product. The work was performed to understand the influence of the various process parameters on the embossed micro-size patterns with the aim to develop the capability for microfluidic devices manufacturing. Microembossed polymer replicates were measured using a PLμ confocal microscope and inspected using a scanning electron microscope. It was established that the optimal embossing temperature for COC is 10°C above its T g, while an optimal embossing load of 2.94 kN and holding time of 180 s are required. We have also demonstrated the effective sealing of the microchannel without destroying the channel integrity by thermal bonding technique. © Springer-Verlag 2011.
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U2 - 10.1007/s00542-011-1366-z
DO - 10.1007/s00542-011-1366-z
M3 - RGC 21 - Publication in refereed journal
SN - 0946-7076
VL - 18
SP - 159
EP - 166
JO - Microsystem Technologies
JF - Microsystem Technologies
IS - 2
ER -