Abstract
Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
| Original language | English |
|---|---|
| Pages (from-to) | 6106-6111 |
| Journal | Advanced Materials |
| Volume | 25 |
| Issue number | 42 |
| DOIs | |
| Publication status | Published - 13 Nov 2013 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Research Keywords
- healing
- interfacial binding
- low temperatures
- metal-organic frameworks
- welding
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