Metal-organic frameworks capable of healing at low temperatures

Ziguang Chen, Gonghua Wang, Zhanping Xu, Hui Li, Alexandre Dhôtel, Xiao Cheng Zeng, Banglin Chen, Jean-Marc Saiter, Li Tan*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Original languageEnglish
Pages (from-to)6106-6111
JournalAdvanced Materials
Volume25
Issue number42
DOIs
Publication statusPublished - 13 Nov 2013
Externally publishedYes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

  • healing
  • interfacial binding
  • low temperatures
  • metal-organic frameworks
  • welding

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