Message from the symposium of engineering test harness chairs

Research output: Journal Publications and Reviews › Editorial Preface

Original language	English
Article number	6605899
Journal	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
DOIs	https://doi.org/10.1109/QSIC.2013.9
Publication status	Published - 2013
Event	13th International Conference on Quality Software, QSIC 2013 - Nanjing, Jiangsu, China Duration: 29 Jul 2013 → 30 Jul 2013

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@article{7375d0b2270048939cac9bf3f7f8fad9,

title = "Message from the symposium of engineering test harness chairs",

author = "Chan, \{W. K.\} and Shing-Chi Cheung",

year = "2013",

doi = "10.1109/QSIC.2013.9",

language = "English",

journal = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

note = "13th International Conference on Quality Software, QSIC 2013 ; Conference date: 29-07-2013 Through 30-07-2013",

}

TY - JOUR

T1 - Message from the symposium of engineering test harness chairs

AU - Chan, W. K.

AU - Cheung, Shing-Chi

PY - 2013

Y1 - 2013

UR - https://www.scopus.com/pages/publications/84885675677

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84885675677&origin=recordpage

U2 - 10.1109/QSIC.2013.9

DO - 10.1109/QSIC.2013.9

M3 - Editorial Preface

JO - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

JF - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

M1 - 6605899

T2 - 13th International Conference on Quality Software, QSIC 2013

Y2 - 29 July 2013 through 30 July 2013

ER -