@inproceedings{57b4cad490c24d54b9cf66988cbe4025,
title = "MEMS on bulk mechanical contour substrates",
abstract = "We have fabricated MEMS structures directly onto non-silicon bulk cylindrical substrates with minimum linewidth resolution better than 5μm. Simple sacrificially released metal structures were realized on a 1.25 inches diameter, 2 inches long cylinder surface which demonstrated our alignment process for making multiple layers of thinfilm micro-structures. We have also initiated work to fabricate MEMS sensors and actuators onto bulk cylindrical substrates and the preliminary results will be presented in this paper.",
author = "Li, \{Wen J.\} and Ho, \{Chih Ming\}",
year = "1997",
language = "English",
volume = "2",
publisher = "IEEE",
pages = "1431--1434",
booktitle = "International Conference on Solid-State Sensors and Actuators, Proceedings",
address = "United States",
note = "Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 2 (of 2) ; Conference date: 16-06-1997 Through 19-06-1997",
}