Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium

Xinrui NIU; Bo XU

Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium

Xinrui NIU (Inventor), Bo XU (Inventor)

Department of Mechanical Engineering

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Original language	English
Patent number	US11,116,096
Publication status	Published - 7 Sept 2021

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title = "Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium",

author = "Xinrui NIU and Bo XU",

year = "2021",

month = sep,

day = "7",

language = "English",

type = "Patent",

note = "US11,116,096",

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Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium. / NIU, Xinrui (Inventor); XU, Bo (Inventor).
Patent No.: US11,116,096. Sept 07, 2021.

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

TY - PAT

T1 - Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium

AU - NIU, Xinrui

AU - XU, Bo

PY - 2021/9/7

Y1 - 2021/9/7

UR - https://www.cityu.edu.hk/kto/technology-redirect/680

M3 - RGC 51 - Patents (CityUHK)

M1 - US11,116,096

ER -

Medium for Binding Components in An Assembly of An Electronic Device, A Method of Preparing The Same, A Display Assembly of An Electronic Device, And A System for Simulating Mechanical Behaviours of The Electronic Device And The Medium

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