Mechanism of stress relaxation in Ge nanocrystals embedded in Si O2

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • I. D. Sharp
  • D. O. Yi
  • Q. Xu
  • C. Y. Liao
  • J. W. Beeman
  • Z. Liliental-Weber
  • D. N. Zakharov
  • J. W. Ager
  • D. C. Chrzan
  • E. E. Haller

Detail(s)

Original languageEnglish
Article number63107
Pages (from-to)1-3
Journal / PublicationApplied Physics Letters
Volume86
Issue number6
Publication statusPublished - 7 Feb 2005
Externally publishedYes

Abstract

Ion-beam-synthesized Ge74 nanocrystals embedded in an amorphous silica matrix exhibit large compressive stresses in the as-grown state. The compressive stress is determined quantitatively by evaluating the Raman line shift referenced to the line position of free-standing nanocrystals. Postgrowth thermal treatments lead to stress reduction. The stress relief process is shown to be governed by the diffusive flux of matrix atoms away from the local nanocrystal growth region. A theoretical model that quantitatively describes this process is presented. © 2005 American Institute of Physics.

Citation Format(s)

Mechanism of stress relaxation in Ge nanocrystals embedded in Si O2. / Sharp, I. D.; Yi, D. O.; Xu, Q. et al.

In: Applied Physics Letters, Vol. 86, No. 6, 63107, 07.02.2005, p. 1-3.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review