Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)7560-7566
Journal / PublicationJournal of Applied Physics
Volume94
Issue number12
Publication statusPublished - 15 Dec 2003
Externally publishedYes

Abstract

The electromigration-induced failure in the composite solder joints consisting of 97Pb-3Sn on the chip side and 37Pb-63Sn on the substrate side was investigated. The failure occurred in joints with chip to substrate electron flow, and the joints with opposite current polarity showed minor changes. Current crowding, observed inside the under-bump metallization (UBM), enhanced the phase transformation of Cu to Cu 3Sn and to Cu 6Sn 5 at the UBM/solder interface. Results show that due to the rapid consumption of Cu UBM, there is a void formation-induced failure at the cathode side.

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Citation Format(s)

Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints. / Nah, J. W.; Paik, K. W.; Suh, J. O. et al.
In: Journal of Applied Physics, Vol. 94, No. 12, 15.12.2003, p. 7560-7566.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review