Mechanical response of polar/non-polar ZnO under low dimensional stress

T. H. Sung; J. C. Huang; H. C. Chen

doi:10.1063/1.4811554

Mechanical response of polar/non-polar ZnO under low dimensional stress

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

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Author(s)

T. H. Sung
J. C. Huang
H. C. Chen

Detail(s)

Original language	English
Article number	241901
Journal / Publication	Applied Physics Letters
Volume	102
Issue number	24
Online published	17 Jun 2013
Publication status	Published - 17 Jun 2013
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1063/1.4811554 Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-84879822283&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(76dfa2dd-1228-40a6-9828-9b809b21cf3e).html

Abstract

The mechanical properties of high quality polar (c-plane) and non-polar (a-plane and m-plane) ZnO wafers were examined by using nanoindentation and microcompression testing. The nano-scaled modulus, hardness, and yield strength readings of the c-plane, a-plane and m-plane ZnO wafers determined by nanoindentation are 140, 159, and 161; 7.1, 3.9, and 4.0; and 12.0, 6.7, and 4.5 GPa, respectively. The micro-scaled data directly measured by microcompression are much lower than the nano-scaled data. The cathodoluminescence images are in consistence with the slip systems observed from the transmission electron microscopy characterization.