Mechanical response of polar/non-polar ZnO under low dimensional stress

T. H. Sung, J. C. Huang*, H. C. Chen

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

13 Citations (Scopus)

Abstract

The mechanical properties of high quality polar (c-plane) and non-polar (a-plane and m-plane) ZnO wafers were examined by using nanoindentation and microcompression testing. The nano-scaled modulus, hardness, and yield strength readings of the c-plane, a-plane and m-plane ZnO wafers determined by nanoindentation are 140, 159, and 161; 7.1, 3.9, and 4.0; and 12.0, 6.7, and 4.5 GPa, respectively. The micro-scaled data directly measured by microcompression are much lower than the nano-scaled data. The cathodoluminescence images are in consistence with the slip systems observed from the transmission electron microscopy characterization.
Original languageEnglish
Article number241901
JournalApplied Physics Letters
Volume102
Issue number24
Online published17 Jun 2013
DOIs
Publication statusPublished - 17 Jun 2013
Externally publishedYes

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