Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

D. W. Zheng; Y. H. Xu; Y. P. Tsai; K. N. Tu; P. Patterson; Bin Zhao; Q. Z. Liu; Maureen Brongo

doi:10.1063/1.126237

Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

D. W. Zheng
, Y. H. Xu
, Y. P. Tsai
, K. N. Tu
, P. Patterson
, Bin Zhao
, Q. Z. Liu
, Maureen Brongo

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

49 Citations (Scopus)

Abstract

We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm². The Si membrane was subsequently removed in a pulsed XeF₂ etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively. © 2000 American Institute of Physics.

Original language	English
Pages (from-to)	2008-2010
Journal	Applied Physics Letters
Volume	76
Issue number	15
DOIs	https://doi.org/10.1063/1.126237
Publication status	Published - 10 Apr 2000
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method",

abstract = "We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40\% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively. {\textcopyright} 2000 American Institute of Physics.",

author = "Zheng, \{D. W.\} and Xu, \{Y. H.\} and Tsai, \{Y. P.\} and Tu, \{K. N.\} and P. Patterson and Bin Zhao and Liu, \{Q. Z.\} and Maureen Brongo",

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TY - JOUR

T1 - Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

AU - Zheng, D. W.

AU - Xu, Y. H.

AU - Tsai, Y. P.

AU - Tu, K. N.

AU - Patterson, P.

AU - Zhao, Bin

AU - Liu, Q. Z.

AU - Brongo, Maureen

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2000/4/10

Y1 - 2000/4/10

N2 - We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively. © 2000 American Institute of Physics.

AB - We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600× 1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8-32.6 and 56.1-72.5 ppm/°C for the dense and porous PAE films, respectively. © 2000 American Institute of Physics.

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U2 - 10.1063/1.126237

DO - 10.1063/1.126237

M3 - RGC 21 - Publication in refereed journal

SN - 0003-6951

VL - 76

SP - 2008

EP - 2010

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 15

ER -

Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method

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