Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

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Detail(s)

Original languageEnglish
Pages (from-to)5665-5671
Journal / PublicationJournal of Applied Physics
Volume94
Issue number9
Publication statusPublished - 1 Nov 2003
Externally publishedYes

Abstract

Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure (MTTF) were studied. Analysis was carried out in the temperature range of 100 to 140 °C. In these joints, the under-bump-metallization on the chip side is a multilayer thin film of Al/Ni(V)/Cu. It was found that the failure occurred by interfacial void propagation at the cathode side, and it is due to current crowding near the contact surface.

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