Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via
- Xiaoyue Ding (Co-first Author)
- , Wei Li (Co-first Author)
- , Yang Xi
- , Hanwen Cui
- , Zhaotian Li
- , Huai Zheng
- , Yingxia Liu
- , Xi Tang
- , Xinlu Teng
- , Yikang Zhou
- , Yuzheng Guo
- , Sheng Liu
- , Zhaofu Zhang*
*Corresponding author for this work
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review